Peter Zogas

Title: The Innovative Contributions of Peter Zogas

Introduction

Peter Zogas is a notable inventor based in Austin, TX. He has made significant contributions to the field of technology, particularly in the area of chip packaging. With a focus on improving packing density, his work has implications for the efficiency and performance of electronic devices.

Latest Patents

Peter Zogas holds a patent for a high-density package. This innovative chip carrier design features improved packing density, where at least one layer of chips is bonded to a heat plate rather than directly to the substrate. The heat plate, which is attached over the chip cavity and inside the hermetic sealing lid, includes openings that allow for the attachment of leads from the chips in the upper layer to bond pads on a bonding ledge inside the chip carrier. This design enhances the bonding process, as the bonding ledge is made wider to accommodate leads from multiple layers of chips.

Career Highlights

Peter Zogas is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to contribute to cutting-edge technologies that are essential for modern electronics. With a total of 1 patent, his innovative designs continue to influence the field.

Collaborations

Throughout his career, Peter has collaborated with talented individuals such as Alex A Oscilowski and Charles E Williams. These collaborations have fostered an environment of innovation and creativity, leading to advancements in chip technology.

Conclusion

Peter Zogas exemplifies the spirit of innovation in the technology sector. His contributions, particularly in chip packaging, demonstrate the importance of creativity and collaboration in driving advancements in electronics.