Peter W Robinson

Title: Innovations of Peter W Robinson in Electronic Packaging

Introduction

Peter W Robinson is a notable inventor based in Bradford, CT (US). He has made significant contributions to the field of electronic packaging, particularly through his innovative patent that addresses critical issues in solder joint reliability.

Latest Patents

Peter W Robinson holds a patent for a "Metal ball grid electronic package having improved solder joint." This invention focuses on reducing the bending of a ball grid array electronic package with a metallic base. By minimizing the stresses applied to the innermost row of solder balls during cyclic heating and cooling, his invention enhances the durability of electronic devices. The patent outlines various means to reduce the bending moment, including a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure, and a package base with a stress-accommodating depressed portion. This innovation significantly increases the number of thermal cycles that the solder balls can endure before failure occurs.

Career Highlights

Peter W Robinson is associated with Advanced Interconnect Technologies Limited, where he applies his expertise in electronic packaging. His work has been instrumental in advancing the reliability and performance of electronic devices.

Collaborations

Some of his notable coworkers include Deepak Mahulikar and Paul R Hoffman, who have collaborated with him on various projects within the company.

Conclusion

Peter W Robinson's contributions to electronic packaging through his innovative patent demonstrate his commitment to enhancing the reliability of electronic devices. His work continues to influence the industry positively.