Peter M Hoffmann

Title: Innovations in Semiconductor Manufacturing by Peter M Hoffmann

Introduction

Peter M Hoffmann is an accomplished inventor based in Baltimore, MD (US). He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent related to copper metallization structures.

Latest Patents

Hoffmann holds a patent for a "Copper metallization structure and method of construction." This invention focuses on utilizing copper as via and interconnect structures for integrated circuits. The process he developed produces an interconnect layer of continuous copper with superior adhesion while minimizing the number of production steps. This innovation addresses the pressing need for reliable and performance-oriented vias and interconnect structures in semiconductor manufacturing, overcoming many issues associated with aluminum.

Career Highlights

Hoffmann's career is marked by his work at The Johns Hopkins University, where he has been instrumental in advancing semiconductor technologies. His expertise in the field has led to the development of processes that enhance the reliability and performance of integrated circuits.

Collaborations

Hoffmann has collaborated with notable colleagues, including Gerko Oskam and Peter C Searson. These partnerships have contributed to the advancement of research and innovation in semiconductor manufacturing.

Conclusion

Peter M Hoffmann's contributions to semiconductor manufacturing through his innovative patent demonstrate his commitment to advancing technology in this critical field. His work continues to influence the development of reliable and efficient integrated circuits.