Peter Khai Mum Fung

Title: Innovations by Peter Khai Mum Fung

Introduction

Peter Khai Mum Fung is a notable inventor based in Singapore, recognized for his contributions to substrate bonding technologies. His innovative work has led to the development of methods that enhance substrate-level packaging, which is crucial in various electronic applications.

Latest Patents

Peter holds 1 patent for his invention titled "Methods for bonding substrates." This patent outlines a process that includes performing electrochemical deposition (ECD) to deposit materials on two substrates, followed by chemical mechanical polishing (CMP) to create bonding interfaces. The method involves aligning and bonding these substrates effectively, which is essential for improving the reliability of electronic devices.

Career Highlights

Peter is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His work at Applied Materials has allowed him to focus on innovative solutions that address the challenges in substrate bonding and packaging.

Collaborations

Peter has collaborated with talented coworkers such as Prayudi Lianto and Guan Huei See, contributing to a dynamic team that drives innovation in their field.

Conclusion

Peter Khai Mum Fung's work exemplifies the importance of innovation in technology, particularly in the realm of substrate bonding. His contributions continue to influence advancements in electronic packaging solutions.