Peter Hübler

Title: Innovations by Peter Hübler in Damascene Processes

Introduction

Peter Hübler is an accomplished inventor based in Coswig, Germany. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of damascene processes. His innovative techniques have the potential to enhance the efficiency and reliability of interconnection processes in microelectronics.

Latest Patents

Peter Hübler holds a patent for "Void formation monitoring in a damascene process." This invention provides a technique for monitoring void formation during the damascene interconnection process. The method involves creating a test structure that includes at least two damascene structures with different cross-sectional geometric parameters. By cutting the test structure to expose a cross-sectional view, the void formation can be inspected and analyzed in each damascene structure. This invention is particularly applicable to multi-level copper-based dual-damascene interconnection processes, allowing for effective monitoring of voids at the interface between barrier layers and bottom metal trenches.

Career Highlights

Peter Hübler is associated with Advanced Micro Devices Corporation, where he has been instrumental in advancing semiconductor technologies. His work focuses on improving the reliability and performance of microelectronic devices through innovative manufacturing techniques.

Collaborations

Peter has collaborated with notable colleagues, including Thomas Werner and Frank Koschinsky, who have contributed to his research and development efforts in the semiconductor industry.

Conclusion

Peter Hübler's contributions to the field of semiconductor manufacturing, particularly through his patent on void formation monitoring, demonstrate his commitment to innovation and excellence. His work continues to influence the development of advanced microelectronic technologies.