Company Filing History:
Years Active: 1983
Title: Innovations of Peter Bernsau in Multilayer Printed Circuit Board Technology
Introduction
Peter Bernsau is a notable inventor based in Munich, Germany. He has made significant contributions to the field of multilayer printed circuit boards, holding 2 patents that showcase his innovative approach to manufacturing processes.
Latest Patents
Bernsau's latest patents include a method and device for producing multilayer printed circuit boards. This invention involves applying heat and pressure to a stack of printed circuit boards and interposed layers of thermosetting plastic. The multilayer stack is heated in a first press to a curing temperature above the flux point of the bonding layers. It is then precooled under continued pressure to a transfer temperature below the flux point and transferred to a second press, where it is aftercooled under pressure to ambient temperature. The press installation includes two independently operating multi-stage presses in a common press frame, with the plates of the press stages horizontally aligned in the open position of the two presses.
Another significant patent is a device for controlling a heated panel press for the assembly of multilayer stacks of printed circuit boards. This device facilitates the switchover from a contact pressure mode to a curing pressure mode. It consists of a displacement transducer that measures the decrease in stack height in terms of displacement pulses, along with a pulse counter and count comparator that produces a switchover signal at a predetermined threshold count. This signal reflects the attainment of the flux point in the bonding layer resin, ensuring precise control during the manufacturing process.
Career Highlights
Peter Bernsau is currently employed at Robert Burkle GmbH & Co., where he continues to develop innovative solutions in the field of printed circuit board technology. His work has significantly advanced the efficiency and effectiveness of multilayer board production.
Collaborations
Bernsau has collaborated with notable colleagues such as Hans Bohn and Wolfgang Stein, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Peter Bernsau's contributions to multilayer printed circuit board technology exemplify his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of manufacturing processes and a drive to improve industry standards.