This inventor holds 1 USPTO granted patent. Top assignee: National University of Singapore. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Perq Jon Chia: Innovator in Electrically Conductive Composites
Introduction
Perq Jon Chia is a notable inventor based in Singapore, recognized for his contributions to the field of materials science. He has developed innovative solutions that enhance the conductivity of composite materials, which have significant applications in various industries.
Latest Patents
Perq Jon Chia holds a patent for an electrically conductive composite. This invention comprises a suspension matrix and metal nanoparticles suspended within the matrix, achieving a conductivity greater than 10^4 S cm. This advancement in conductive materials opens new avenues for technological applications.
Career Highlights
Chia is affiliated with the National University of Singapore, where he engages in research and development in materials science. His work focuses on creating advanced materials that can be utilized in electronics and other high-tech applications.
Collaborations
Some of his notable coworkers include Kian-Hoon Peter Ho and Lay-Lay Chua, who contribute to the collaborative research environment at the National University of Singapore.
Conclusion
Perq Jon Chia's innovative work in electrically conductive composites exemplifies the impact of research and development in advancing technology. His contributions are paving the way for future innovations in material science.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile