Company Filing History:
Years Active: 2010
Title: Payal Kaul: Innovator in Heat Shrinkable Film Technology
Introduction
Payal Kaul is a prominent inventor based in San Jose, California. She has made significant contributions to the field of packaging technology, particularly in the development of heat shrinkable films. Her innovative work has led to advancements that are beneficial for high-speed industrial processes.
Latest Patents
Payal Kaul holds a patent for a heat shrinkable film with a (meth)acrylate resin curable adhesive. This invention includes a heat shrinkable label that comprises a heat shrinkable film made from at least one thermoplastic polymer and a curable adhesive. The adhesive consists of a urethane (meth)acrylate resin, a tackifier, and a photoinitiator. The film demonstrates an ultimate shrinkage at 135°C of at least 15%, and the adhesive possesses sufficient precure tack, with a loop tack of at least 4.3 g/cm. This heat shrinkable label is particularly useful in high-speed industrial processes, such as beverage container labeling.
Career Highlights
Payal Kaul is currently employed at Avery Dennison Corporation, where she continues to innovate and develop new technologies. Her work has been instrumental in enhancing the efficiency and effectiveness of packaging solutions.
Collaborations
Payal collaborates with talented individuals in her field, including Moris Amon and Christopher J. Blackwell. These partnerships foster a creative environment that drives innovation and leads to successful projects.
Conclusion
Payal Kaul is a remarkable inventor whose contributions to heat shrinkable film technology have made a significant impact in the packaging industry. Her innovative spirit and dedication to her work continue to inspire others in the field.