Colchester, VT, United States of America

Paul Wojtuszewski


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 26(Granted Patents)


Company Filing History:

goldMedal1 out of 832,966 
Other
 patents

Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Paul Wojtuszewski

Introduction

Paul Wojtuszewski is a notable inventor based in Colchester, Vermont. He has made significant contributions to the field of electronic device manufacturing, particularly through his innovative patent related to dry adhesive joining methods. His work focuses on enhancing the efficiency and cost-effectiveness of bonding layers in electronic devices.

Latest Patents

Wojtuszewski holds a patent for a method titled "Dry adhesive joining of layers of electronic devices." This patent describes an efficient production method that bonds layers of electronic devices into an integral stack. The process involves a two-stage bonding technique using an adhesive material, preferably polyimide. In the first stage, the electronic device is coated with a liquid adhesive solution, which is then heated to remove the solvent, forming a dry adhesive coating. This coating fills all spaces between metal traces on the device. The second stage involves stacking the coated wafers and applying heat and pressure to cause the adhesive to flow and cure, resulting in a strong, void-free bond.

Career Highlights

Throughout his career, Wojtuszewski has focused on developing innovative solutions that improve the manufacturing processes of electronic devices. His patent reflects his commitment to advancing technology in this field. His work has the potential to significantly impact the efficiency of electronic device production.

Collaborations

Wojtuszewski has collaborated with notable professionals in his field, including Angel Antonio Pepe and David M Reinker. These collaborations have likely contributed to the development and refinement of his innovative ideas.

Conclusion

Paul Wojtuszewski's contributions to the field of electronic device manufacturing through his innovative patent demonstrate his expertise and commitment to advancing technology. His work in developing efficient bonding methods is a testament to his role as a significant inventor in the industry.

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