Florissant, MO, United States of America

Paul Thomas Smith


Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 289(Granted Patents)


Company Filing History:


Years Active: 1994-2013

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6 patents (USPTO):

Title: Paul Thomas Smith: Innovator in Equipment Enclosure Technology

Introduction

Paul Thomas Smith is a notable inventor based in Florissant, MO (US). He has made significant contributions to the field of electronic component housing, holding a total of 6 patents. His innovative designs have paved the way for advancements in equipment enclosure technology.

Latest Patents

One of Paul Thomas Smith's latest patents is the "Equipment enclosure kit and assembly method." This invention features an equipment enclosure designed to house electronic components. The enclosure includes a front assembly with a front frame, defining the front of the enclosure, and a rear assembly with a rear frame. Additionally, it incorporates at least two side brace members, each with a first and second end. A first connector is designed to releasably connect the first end of one of the side brace members to the front frame, while a second connector connects the second end to the rear frame. Other embodiments and methods are also disclosed in this patent.

Career Highlights

Throughout his career, Paul has worked with prominent companies such as American Power Conversion Corporation and Schneider Electric IT Corporation. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic component housing.

Collaborations

Paul has collaborated with several professionals in his field, including Jeffrey Lee Mattlin and Joseph H. Bergesch. These collaborations have further enhanced his work and contributed to the success of his inventions.

Conclusion

Paul Thomas Smith is a distinguished inventor whose work in equipment enclosure technology has led to multiple patents and significant advancements in the industry. His contributions continue to influence the design and functionality of electronic component housing solutions.

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