New Market, AL, United States of America

Paul S Wein, Jr


Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2015-2019

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3 patents (USPTO):Explore Patents

Title: Paul S Wein, Jr: Innovator in Telecommunications Enclosures

Introduction

Paul S Wein, Jr is a notable inventor based in New Market, AL (US). He has made significant contributions to the field of telecommunications, holding a total of 3 patents. His work focuses on innovative designs that enhance the functionality and efficiency of telecommunications enclosures.

Latest Patents

One of his latest patents is for a frameless telecommunications enclosure. This invention describes a telecommunications enclosure that includes side panels with seals and an enclosure top that is connected, independent of a frame, to the top ends of the side panels. The enclosure top features an outer end that extends between the side panels and includes a seal. Additionally, an interior panel is connected, independent of a frame, to the side panels, with its outer end extending between the side panels. The interior panel is separated from the enclosure top by a specified distance and is also distanced from the bottom ends of the side panels. A removable door is designed to engage the seals when secured to the frameless telecommunications enclosure.

Career Highlights

Paul S Wein, Jr is currently employed at Adtran GmbH, where he continues to innovate in the telecommunications sector. His work has been instrumental in developing solutions that address the evolving needs of the industry.

Collaborations

Throughout his career, Paul has collaborated with talented individuals such as Jeremy Lee Harris and Jon Michael Chalmers. These collaborations have contributed to the advancement of his projects and innovations.

Conclusion

Paul S Wein, Jr is a distinguished inventor whose work in telecommunications enclosures has made a significant impact on the industry. His innovative designs and collaborative efforts continue to drive advancements in this field.

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