Company Filing History:
Years Active: 1992
Title: The Innovative Contributions of Paul M. Knudsen
Introduction
Paul M. Knudsen is a notable inventor based in Elk Mound, Wisconsin. He has made significant contributions to the field of integrated circuits through his innovative designs. His work has led to advancements that enhance the performance and efficiency of electronic devices.
Latest Patents
One of Paul M. Knudsen's key patents is for a "Reduced Capacitance Chip Carrier." This invention describes a ceramic chip carrier package for integrated circuits that provides reduced interlead capacitance. The design features a centrally located cavity for the integrated circuit chip on a substrate. The leads of the package are bridged between the cavity and the outer periphery of the substrate. Adhesive glass is used to bond the leads to the substrate at specific locations, while sealing glass is applied to create a secure lid for the package. Notably, the area between the cavity and the outer periphery of the substrate is free of adhesive or sealing glass, allowing for an air dielectric that reduces interlead capacitance. This innovative approach results in lower capacitance compared to prior art packages.
Career Highlights
Paul M. Knudsen has worked with Cray Research, Inc., where he has been able to apply his inventive skills in a collaborative environment. His contributions have been instrumental in advancing the technology used in high-performance computing.
Collaborations
Throughout his career, Paul has collaborated with notable colleagues such as Peter J. Wehner and David F. Leonard. These partnerships have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Paul M. Knudsen's work exemplifies the spirit of innovation in the field of integrated circuits. His patented designs have made a lasting impact on the industry, showcasing the importance of reducing interlead capacitance in electronic devices. His contributions continue to influence the future of technology.