Paul J Eckhoff

Title: Paul J Eckhoff: Innovator in Thickness Planing Technology

Introduction

Paul J Eckhoff is a notable inventor based in O'Fallon, MO (US). He has made significant contributions to the field of thickness planing technology, holding a total of 4 patents. His innovative designs focus on enhancing the efficiency and functionality of thickness planers.

Latest Patents

Eckhoff's latest patents include a "Thickness Planer with Locking Mechanism" and a "Blade Tool for Cutter Head of Thickness Planers." The thickness planer patent describes a carriage locking mechanism that minimizes vibration and movement during operation. It also features a depth of cut indicator to display the thickness of material to be removed. Additionally, it includes a mechanism for quickly and accurately setting the carriage and cutting head to a predetermined height. The blade tool patent provides a handle and hook portion designed for the easy removal and installation of blades in a cutter head. This tool may also incorporate a rare earth magnet to assist in extracting the blade once loosened.

Career Highlights

Eckhoff is associated with Emerson Electric Company, where he has contributed to the development of innovative tools and technologies. His work has significantly impacted the efficiency of woodworking processes.

Collaborations

Throughout his career, Eckhoff has collaborated with notable colleagues, including Randall E Campbell and Frank J Tomiser, Jr. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Paul J Eckhoff's contributions to thickness planing technology demonstrate his commitment to innovation and efficiency in woodworking. His patents reflect a deep understanding of the needs of the industry and a dedication to improving existing tools.