Arvada, CO, United States of America

Paul H Stasiewicz, Jr


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Paul H Stasiewicz, Jr.

Introduction

Paul H Stasiewicz, Jr. is a notable inventor based in Arvada, CO (US). He has made significant contributions to the field of chemical mechanical planarization (CMP) through his innovative designs and patents. His work is particularly recognized for enhancing the efficiency and effectiveness of substrate handling in CMP apparatuses.

Latest Patents

Stasiewicz holds a patent for a "Low friction gimbaled substrate holder for CMP apparatus." This invention provides an assembly for holding a substrate in a CMP apparatus. The assembly includes a holder frame that is insertable into the CMP apparatus, featuring an inner wall. It also incorporates at least one rolling mechanism that is rotatably mounted in the holder frame, allowing a portion of the mechanism to protrude from the inner wall. Additionally, the assembly includes a wafer chuck that is movably mounted in the holder frame. The wafer chuck is designed with a first side that conforms to the inner wall and maintains continuous contact with the rolling mechanism during planarization. The second side of the chuck is adapted to receive a substrate for planarization. This patent aims to reduce friction in the gimbaling mechanism of a wafer chuck during the planarization process.

Career Highlights

Stasiewicz is currently employed at Lam Research Corporation, where he continues to develop innovative solutions in the semiconductor manufacturing industry. His work has contributed to advancements in CMP technology, which is crucial for the production of integrated circuits.

Collaborations

Throughout his career, Stasiewicz has collaborated with talented individuals such as Erik H Engdahl and Michael David Steiman. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Paul H Stasiewicz, Jr. is a distinguished inventor whose contributions to CMP technology have made a significant impact in the semiconductor industry. His innovative patent for a low friction gimbaled substrate holder exemplifies his commitment to enhancing manufacturing processes. His work continues to inspire advancements in the field.

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