Houston, TX, United States of America

Paul Danna


Average Co-Inventor Count = 3.6

ph-index = 1


Location History:

  • Houston, TX (US) (2022)
  • Pearland, TX (US) (2024)

Company Filing History:


Years Active: 2022-2025

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4 patents (USPTO):Explore Patents

Title: Paul Danna: Innovator in High-Speed PCB Technology

Introduction

Paul Danna is a notable inventor based in Houston, TX, who has made significant contributions to the field of printed circuit board (PCB) technology. With a total of 4 patents to his name, Danna has focused on innovations that enhance the efficiency and performance of electronic components.

Latest Patents

Danna's latest patents include "Power via resonance suppression," which describes a printed circuit board that incorporates multiple layers and plated through-hole (PTH) vias. This design allows for effective power distribution to components mounted on the top layer. Another significant patent is the "Dual-path high-speed interconnect PCB layout solution," which provides a dual-path signal interconnect that facilitates high-speed electrical signal routing through strategically placed solder pads.

Career Highlights

Paul Danna is currently employed at Hewlett Packard Enterprise Development LP, where he continues to innovate and develop advanced PCB technologies. His work has been instrumental in improving the performance of electronic devices, making them more efficient and reliable.

Collaborations

Danna has collaborated with talented coworkers such as Chi Kim Sides and Melvin K Benedict, contributing to a dynamic team focused on cutting-edge technology.

Conclusion

In summary, Paul Danna is a distinguished inventor whose work in PCB technology has led to several important patents. His contributions continue to shape the future of electronic design and innovation.

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