Bodelshausen, Germany

Paul Boos


 

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Rottenburg, DE (2018)
  • Bodelshausen, DE (2020 - 2021)

Company Filing History:


Years Active: 2018-2021

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Paul Boos

Introduction

Paul Boos is a notable inventor based in Bodelshausen, Germany. He has made significant contributions to the field of engineering, particularly in the development of advanced clamping and measuring technologies. With a total of four patents to his name, Boos has demonstrated a commitment to innovation and precision in his work.

Latest Patents

Among his latest patents is a vacuum chuck designed for clamping workpieces, specifically wafers. This innovative device features a clamping plate with a support surface and at least one suction connection that links to a negative-pressure device. The vacuum chuck utilizes several suction grooves that are open towards the support surface, allowing for effective clamping of workpieces through negative pressure. Each suction groove can be controlled separately by a control valve, enabling precise management of the negative pressure applied to each groove. Additionally, Boos has developed a measuring device and method for checking workpieces using X-ray fluorescent radiation, further showcasing his expertise in the field.

Career Highlights

Throughout his career, Paul Boos has worked with reputable companies such as Helmut Fischer GmbH Institut Für Elektronik Und Messtechnik and Bizerba SE & Co. KG. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Some of his notable coworkers include Werner Volz and Henry Thiele. Their collaboration has likely fostered an environment of creativity and innovation, leading to the development of advanced technologies.

Conclusion

Paul Boos is a distinguished inventor whose work in vacuum chuck technology and measuring devices has made a significant impact in the engineering field. His patents reflect a deep understanding of the complexities involved in clamping and measuring workpieces, particularly in the semiconductor industry.

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