Company Filing History:
Years Active: 2018
Title: Patrick Verdonck: Innovator in Semiconductor Bonding Technology
Introduction
Patrick Verdonck is a notable inventor based in Sterrebeek, Belgium. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer bonding. His innovative approach has led to advancements that enhance the performance and reliability of semiconductor devices.
Latest Patents
Patrick Verdonck holds a patent for a method of bonding semiconductor substrates. This technology focuses on semiconductor wafer bonding, specifically through direct bonding by contacting the surfaces of the semiconductor wafers. The method involves several steps, including the application of a dielectric layer on the contact surfaces of the substrates, followed by a chemical mechanical polishing (CMP) step to reduce the roughness of the dielectric layer. A layer of SiCN is then deposited, which also undergoes a CMP step to achieve a roughness of approximately one-tenth of a nanometer. The substrates are subjected to a pre-bond annealing step before being bonded through direct bonding, which may include pre-treatments of the contact surfaces and a post-bond annealing step at temperatures not exceeding 250°C. This innovative bonding method has demonstrated excellent bond strength, even at lower annealing temperatures than those currently known in the field.
Career Highlights
Patrick Verdonck is associated with Imec Vzw, a leading research and innovation hub in nanoelectronics and digital technologies. His work at Imec has positioned him at the forefront of semiconductor research, allowing him to collaborate with other experts in the field.
Collaborations
Some of Patrick's notable coworkers include Soon-Wook Kim and Lan Peng. Their collaborative efforts contribute to the advancement of semiconductor technologies and innovations.
Conclusion
Patrick Verdonck's contributions to semiconductor bonding technology exemplify the importance of innovation in the electronics industry. His patented methods are paving the way for improved semiconductor performance and reliability.