Patrick Breling

Title: Patrick Breling - Innovator in Electroplating Technology

Introduction

Patrick Breling is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of electroplating, particularly through his innovative patent that enhances the efficiency and uniformity of metal layer applications on wafers.

Latest Patents

Breling holds a patent for a "Method and apparatus for electroplating." This invention involves an apparatus designed to electroplate a layer of metal on the surface of a wafer. The apparatus features an ionically resistive ionically permeable element positioned close to the wafer, which modulates ionic current at the wafer surface. Additionally, a second cathode is configured to divert a portion of the current from the wafer surface. The preferred embodiment of the ionically resistive element is a disk made of a resistive material with multiple perforations, which effectively redistributes ionic current in the plating system. This configuration allows for the plating of uniform metal layers while mitigating the terminal effect.

Career Highlights

Patrick Breling is associated with Novellus Systems Incorporated, where he applies his expertise in electroplating technology. His work has contributed to advancements in semiconductor manufacturing processes, particularly in achieving high-quality metal layers on wafers.

Collaborations

Breling has collaborated with notable colleagues, including Jonathan David Reid and Bryan L. Buckalew. Their combined efforts in the field of electroplating have furthered the development of innovative solutions in semiconductor technology.

Conclusion

Patrick Breling's contributions to electroplating technology through his patent demonstrate his commitment to innovation in the semiconductor industry. His work continues to influence advancements in the field, showcasing the importance of effective metal layer applications on wafers.