Company Filing History:
Years Active: 1995-2007
Title: **Innovator Spotlight: Patrick B. Halahan**
Introduction
Patrick B. Halahan is a prominent inventor based in San Mateo, California, known for his contributions to the field of integrated circuits and packaging substrates. With a remarkable portfolio of 11 patents, Halahan has made significant advancements in semiconductor interposer technology.
Latest Patents
Among his latest innovations, Halahan has developed patents that focus on integrated circuits and packaging substrates with cavities, along with attachment methods involving the insertion of protruding contact pads into those cavities. His work includes designs featuring semiconductor interposers that connect contact pads through conductive paths, enabling reliable mechanical connections and simplifying interposer handling, especially with thinner designs. Moreover, he has devised methods that enhance the soldering processes for packaging substrates, ensuring that each stage maintains the integrity of the solder hierarchy.
Career Highlights
Throughout his career, Halahan has been associated with notable organizations such as Tru-Si Technologies, Inc. and Siemens Aktiengesellschaft. His work at these companies has contributed to various technological advancements that integrate his patented concepts into practical applications.
Collaborations
Halahan has collaborated with talented individuals in the field, including colleagues like Sergey Savastiouk and Sam Kao. These partnerships have likely played a pivotal role in fostering innovation and driving forward the projects they worked on together.
Conclusion
Patrick B. Halahan's inventive spirit and expertise in semiconductor technology are evident in his portfolio of patents and professional experience. His contributions continue to influence the development of integrated circuits and packaging substrates, showcasing his impactful role in the field of electronics and innovation.