Patrick A Toole

Title: The Innovative Mind of Patrick A Toole

Introduction

Patrick A Toole, an accomplished inventor based in Westport, CT, has made significant contributions to the field of electronic packaging. With two patents to his name, he has demonstrated a commitment to advancing technology through innovative designs and methods. His work is particularly notable within the realm of semiconductor chip carriers, showcasing his expertise and dedication to improving electronic systems.

Latest Patents

Among Patrick's latest patents is the "Full Panel Electronic Packaging Structure." This innovation involves a comprehensive electronic packaging solution, which includes a flexible film semiconductor chip carrier mounted on a circuitized substrate, such as a printed circuit board. The design features a series of semiconductor chips arranged in a specific pattern on the carrier. This configuration allows for efficient mounting on corresponding bonding sites on the substrate. Notably, the flexible film chip carrier facilitates heat transfer from the mounted chips to a heat sink integrated within the substrate. This inventive approach not only enhances the functionality of semiconductor chips but also allows for preliminary testing and burning-in of the chips while still mounted on the carrier before final integration.

Career Highlights

Patrick Toole has built a noteworthy career at the International Business Machines Corporation (IBM), where he has been guided by a vision for transformative technological advancements. His inventions are recognized for their practical application and ability to streamline manufacturing processes within the electronics industry. His contributions at IBM highlight a commitment to research and development that spurs continued innovation.

Collaborations

Throughout his career, Patrick has had the opportunity to collaborate with esteemed colleagues, including Charles E Gazdik and Donald G McBride. Working alongside such talented professionals has undoubtedly influenced his innovative perspective and has contributed to the robust ideas that characterize his patents. These collaborations showcase a blend of expertise that enhances the power of teamwork in driving significant advancements in technology.

Conclusion

Patrick A Toole's contributions to the field of electronic packaging are invaluable. His patent for the Full Panel Electronic Packaging Structure exemplifies his innovative spirit and provides practical solutions to complex challenges in the electronics sector. With a successful career at IBM and collaborations with notable associates, Patrick continues to pave the way for future innovations in semiconductor technology.