Company Filing History:
Years Active: 2004
Title: Parker A Wood: Innovator in CMP Polishing Technology
Introduction
Parker A Wood is a notable inventor based in Fair Oaks Ranch, Texas. He has made significant contributions to the field of chemical mechanical polishing (CMP) technology. His innovative approach has led to the development of a unique slurry removal control mechanism that enhances the efficiency of CMP polishers.
Latest Patents
Parker A Wood holds 1 patent for his invention titled "CMP polisher substrate removal control mechanism and method." This patent describes a slurry removal control mechanism designed for CMP polishers. The mechanism utilizes a high-pressure fluid spray to remove slurry from the polishing pad after the slurry dispense has been terminated. The polishing pad is rotated at a high RPM rate, effectively clearing the slurry from contact with the wafer. Additionally, the invention includes a slurry dispense bar equipped with high-pressure spray nozzles that activate upon the termination of slurry dispense.
Career Highlights
Parker A Wood is currently employed at Koninklijke Philips Corporation N.V., where he continues to innovate in the field of CMP technology. His work has been instrumental in advancing the capabilities of polishing equipment used in semiconductor manufacturing.
Collaborations
Parker has collaborated with several talented individuals in his field, including coworkers Landon B Vines and Paul Douglas, Jr. Their combined expertise contributes to the innovative environment at Koninklijke Philips Corporation N.V.
Conclusion
Parker A Wood's contributions to CMP technology exemplify the spirit of innovation in the semiconductor industry. His patented slurry removal control mechanism represents a significant advancement in the efficiency of CMP polishers.