Company Filing History:
2 out of 395 
2 out of 61 
1 out of 1,030 
Years Active: 2015-2023
Title: The Innovations of Pak Meng Cham
Introduction
Pak Meng Cham is an accomplished inventor based in Plano, TX (US). He has made significant contributions to the field of packaging and ultrasonic welding, holding a total of 5 patents. His innovative designs reflect a commitment to advancing technology and improving product functionality.
Latest Patents
One of his latest patents is for multi-layered packaging films. This invention includes an outer print layer, an inner product-side layer, and a lamination layer interposed between the two. Another notable patent is for a transverse sonotrode design for ultrasonic welding. This system features an ultrasonic transducer that converts electricity into ultrasonic waves, which propagate in a specific direction. The sonotrode is designed with nodal and anti-nodal regions, allowing it to effectively redirect and manipulate ultrasonic waves for enhanced welding performance.
Career Highlights
Throughout his career, Pak Meng Cham has worked with prominent companies such as Frito-Lay North America, Inc. and Edison Welding Institute, Inc. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Pak has collaborated with notable coworkers, including Glenn T. Jordan and Matthew A. Short. Their combined expertise has fostered a creative environment that encourages innovation and problem-solving.
Conclusion
Pak Meng Cham's contributions to the fields of packaging and ultrasonic welding demonstrate his dedication to innovation. His patents and career achievements highlight the impact of his work on modern technology.