Pai-Sheng Shih

Title: Pai-Sheng Shih: Innovator in Electronic Packaging Technology

Introduction

Pai-Sheng Shih is a notable inventor based in Nantou County, Taiwan. He has made significant contributions to the field of electronic packaging, holding three patents that showcase his innovative approach to manufacturing methods.

Latest Patents

His latest patents include a manufacturing method for an electronic packaged device. This method involves the arrangement of multiple electronic components on a substrate carrier, which is then covered by an encapsulating member. The substrate carrier is separated from the encapsulating member, and a series of first trenches are created on the encapsulating member's surface. Conductive material is applied to form a conductive layer, which is patterned to create a circuit layer that includes at least one grounding pad. Additionally, second trenches are arranged on the opposite surface, where shielding structures are formed. An electromagnetic shielding layer is connected to the grounding pad, enhancing the device's functionality.

Career Highlights

Throughout his career, Pai-Sheng Shih has worked with prominent companies such as Universal Scientific Industrial (Shanghai) Co., Ltd. and Universal Global Scientific Industrial Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic packaging technology.

Collaborations

Some of his notable coworkers include Jen-Chun Chen and Hsin-Chin Chang, who have collaborated with him on various projects.

Conclusion

Pai-Sheng Shih's innovative work in electronic packaging has led to significant advancements in the field. His patents reflect a deep understanding of manufacturing processes and a commitment to enhancing electronic device performance.