Muncy, PA, United States of America

Oszkar Bittner


Average Co-Inventor Count = 1.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 1996-1997

Loading Chart...
3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Oszkar Bittner

Introduction

Oszkar Bittner is a notable inventor based in Muncy, PA, who has made significant contributions to the field of die mount technology. With a total of three patents to his name, Bittner's work focuses on improving the efficiency and functionality of die mounts used in various applications.

Latest Patents

Bittner's latest patents include the Double Tapered Die Mount and the Single Tapered Die Mount. The Double Tapered Die Mount defines a channel that supports the die shoulder without any contact between the die and die housing. This innovative design allows for a congruent relationship between the die shoulder and the channel shape of the die mount. The die shoulder is machined to taper from both the inner and outer radial surfaces toward the die edge, creating an effective inner and outer die taper. This design ensures that radial and torque forces are effectively managed during operation. The Single Tapered Die Mount features a radially inner surface angled to the axis of rotation, which supports and positions the die within the die holder. This mount employs a modified Morse taper to enhance the connection between the die and the die holder.

Career Highlights

Oszkar Bittner is currently associated with Andritz Sprout-Bauer, Inc., where he continues to innovate and develop advanced solutions in die mount technology. His expertise and contributions have positioned him as a key figure in his field.

Collaborations

[This section has been skipped due to space constraints.]

Conclusion

Oszkar Bittner's innovative patents and contributions to die mount technology reflect his commitment to enhancing industrial processes. His work continues to influence the industry and showcases the importance of innovation in engineering.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…