Company Filing History:
Years Active: 2000-2004
Title: Osamu Hisada: Innovator in Multilayer-Wiring Substrates
Introduction
Osamu Hisada is a notable inventor based in Aichi, Japan. He has made significant contributions to the field of multilayer-wiring substrates, showcasing his expertise through his innovative patents. His work has implications for the manufacturing of printed circuit boards, which are essential in modern electronics.
Latest Patents
Hisada holds two patents that highlight his innovative approach. The first patent is for a multilayer-wiring substrate and method for fabricating the same. This invention involves a via hole structure that enhances electrical continuity between conductors. The process includes forming a via-hole through lithography or laser-drilling, followed by resin-etching to expose the lower conductor's surface. This method ensures that undesired materials are removed, allowing for reliable electrical connections.
The second patent pertains to a method of making a printed board. This method involves creating a base with through via conductors and blind via conductors, which are filled with resin paste. His approach allows for the upper surfaces of the resin fillings to remain higher than the base surface, eliminating the need for additional manufacturing steps and reducing costs.
Career Highlights
Osamu Hisada is currently employed at NGK Spark Plug Company, Limited. His work at this company has allowed him to further develop his innovative ideas and contribute to advancements in the field of electronics. His expertise in multilayer-wiring substrates has positioned him as a key figure in this area of technology.
Collaborations
Hisada has collaborated with notable coworkers, including Kozo Yamasaki and Katsuhiko Hasegawa. These collaborations have likely enriched his work and contributed to the development of his patents.
Conclusion
Osamu Hisada's contributions to the field of multilayer-wiring substrates and printed board manufacturing demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to improving electronic manufacturing processes, making him a significant figure in the industry.