Ong King Hoo

Title: Biography of Ong King Hoo

Introduction

Ong King Hoo is an accomplished inventor based in Perak, Malaysia. He is known for his innovative contributions to the field of semiconductor technology. With a focus on improving manufacturing processes, Ong has made significant strides in enhancing the mechanical robustness of semiconductor devices.

Latest Patents

Ong King Hoo holds a patent for a flip-chip on lead frame. This invention discloses a flip-chip-type method of assembling semiconductor devices. The proposed invention offers a one-step encapsulation process to promote adhesion of the die to the lead finger and prevent potential shorts from developing between adjacent bumps or lead fingers. Conventional mold compound is utilized to reduce localized stress caused by the coefficient of thermal expansion (CTE) mismatch between the die and substrate or the lead frame. This method is particularly favorable in promoting greater mechanical robustness of semiconductor devices. The one-step encapsulation process simplifies, speeds up, and reduces the cost of the manufacturing process.

Career Highlights

Ong King Hoo is currently employed at Carsem Semiconductor Sdn. Bhd., where he continues to innovate and contribute to the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor device assembly.

Collaborations

Throughout his career, Ong has collaborated with various professionals in the field, including his coworker, Lily Khor. These collaborations have fostered a creative environment that encourages