Oh-Sik Kwon

Title: Oh-Sik Kwon: Innovator in Semiconductor Packaging

Introduction

Oh-Sik Kwon is a prominent inventor based in Seoul, South Korea. He is known for his contributions to the field of semiconductor packaging, particularly through his innovative designs that enhance the efficiency and reliability of semiconductor chip packages.

Latest Patents

Kwon holds a patent for a high-density vertically mounted semiconductor package. This invention features a semiconductor chip package that includes leads protruding from one side of the package body. The design incorporates support portions at both ends of the package body, which are made from the same material as the package body. This unique configuration allows for firm mounting on a printed circuit board (PCB). The package also includes a slot to protect the leads, which are alternately formed to enable close mounting of packages. This design simplifies the mounting process by eliminating the need for additional holes in the PCB, thereby improving packing density and reliability.

Career Highlights

Oh-Sik Kwon is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the semiconductor industry. His work has significantly contributed to advancements in semiconductor packaging technology.

Collaborations

Kwon has collaborated with notable colleagues, including Joon Keun Lee and Hyeon J Jeong, to further enhance the development of semiconductor technologies.

Conclusion

Oh-Sik Kwon's innovative approach to semiconductor packaging has made a significant impact on the industry. His patent for a high-density vertically mounted semiconductor package exemplifies his commitment to improving technology and efficiency in electronic components.