Norman E McNeal

Title: The Innovations of Norman E McNeal

Introduction

Norman E McNeal is a notable inventor based in Carlsbad, CA, who has made significant contributions to the field of integrated circuit packaging. With a total of 3 patents to his name, McNeal's work has advanced the technology used in electronic devices.

Latest Patents

One of his latest patents is the "Thermoplastic plug method of fabricating an integrated circuit package." This innovative method involves assembling a stack of thin flat epoxy-glass layers, with adhesive layers in between. A staircase-shaped cavity is created, extending from an outer epoxy-glass layer to an internal one. Conductors are placed on the internal layer, including bonding pads. A thermoplastic plug is inserted into the cavity, which conforms to the shape of the cavity during lamination, preventing adhesive from flowing onto the bonding pads. Another significant patent is the "Epoxy-glass integrated circuit package having bonding pads in a stepped configuration." This patent describes a similar stack of epoxy-glass layers, laminated together with prepreg layers, featuring a staircase-shaped cavity and patterned electrical conductors.

Career Highlights

Throughout his career, McNeal has worked with prominent companies such as Burroughs, Inc. and Unisys Corporation. His experience in these organizations has contributed to his expertise in integrated circuit technology.

Collaborations

Some of his notable coworkers include Richard A Nagy and Ronald Allen Norell, who have also made contributions to the field of electronics.

Conclusion

Norman E McNeal's innovative patents and career achievements highlight his significant role in advancing integrated circuit packaging technology. His work continues to influence the electronics industry today.