Company Filing History:
Years Active: 2005
Title: Norio Kimura: Innovator in Chemical Mechanical Polishing Technology
Introduction
Norio Kimura is a prominent inventor based in San Jose, CA, known for his contributions to the field of chemical mechanical polishing. With a focus on enhancing the efficiency and effectiveness of polishing processes, Kimura has developed innovative solutions that are crucial in various manufacturing applications.
Latest Patents
One of Kimura's notable patents is the "Chemical Mechanical Polishing Endpoint Detection System and Method." This invention includes a polishing pad, a pad height sensor, a window, and a window raising mechanism. The polishing pad features an aperture that allows the window to move vertically. The pad height sensor, positioned above the polishing pad, measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. Additionally, an endpoint measurement sensor can be placed beneath the window for in-situ measurement of the polishing process. This patent showcases Kimura's innovative approach to improving polishing technology.
Career Highlights
Norio Kimura is associated with Ebara Technologies Incorporated, where he has made significant contributions to the development of advanced polishing technologies. His work has been instrumental in enhancing the performance and reliability of chemical mechanical polishing systems.
Collaborations
Throughout his career, Kimura has collaborated with talented professionals, including Huey-Ming Wang and Masayuki Kumekawa. These collaborations have fostered innovation and have led to advancements in the field of polishing technology.
Conclusion
Norio Kimura's innovative work in chemical mechanical polishing has made a lasting impact on the industry. His patent for the endpoint detection system exemplifies his commitment to advancing technology in this field. Kimura's contributions continue to influence the development of efficient polishing processes.