Nobutsugu Iizawa

Title: Nobutsugu Iizawa: Innovator in Circuit Package Technology

Introduction

Nobutsugu Iizawa is a notable inventor based in Minowa, Japan. He has made significant contributions to the field of circuit packaging, showcasing his innovative spirit and technical expertise. His work has led to the development of a unique circuit package that enhances the functionality and reliability of electronic devices.

Latest Patents

Iizawa holds a patent for a circuit package that features a framed resonator leaf mounted in a recessed portion of a plastic body. The design of the recess is specifically crafted to orient and support the resonator frame. An electrically conductive adhesive is utilized to bond the resonator frame to the body while also establishing an electrical connection to lead electrodes embedded within the body. Additionally, a circuit chip element is integrated into the package, providing a comprehensive solution for circuit design. A protective cover is bonded over the recess to safeguard the resonator element, eliminating the need for welded connections and a resonator mounting plate. This innovative approach simplifies the manufacturing process and enhances the overall performance of the circuit package.

Career Highlights

Nobutsugu Iizawa is associated with Matsushima Kogyo Kabushiki Kaisha, where he continues to develop and refine his inventions. His work at the company has allowed him to focus on advancing circuit technology and improving electronic components.

Collaborations

Due to space constraints, the details of collaborations will not be included.

Conclusion

Nobutsugu Iizawa's contributions to circuit package technology exemplify his innovative mindset and dedication to improving electronic design. His patent reflects a significant advancement in the field, showcasing the potential for enhanced functionality in electronic devices.