Nobuo Ohyama

Title: Nobuo Ohyama: Innovator in Semiconductor Fabrication

Introduction

Nobuo Ohyama is a prominent inventor based in Satsuma-gun, Japan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for fabricating semiconductor devices.

Latest Patents

Ohyama holds a patent for a "Method and apparatus for fabricating semiconductor device." This invention involves a method for creating semiconductor devices that include resin packages sealing semiconductor elements and external connection terminals. The process features resin projections formed on the resin packages and metallic film parts provided to these projections. The semiconductor elements are mounted to a lead frame with recess portions that correspond to the resin projections. The elements are electrically connected to the metallic film parts, and the resin packages are integrally formed with the packages that seal the semiconductor elements. The lead frame is etched to separate the resin packages from the frame along with the metallic layer parts. The resin packages are then attached to an adhesive tape used as a carrier.

Career Highlights

Nobuo Ohyama is associated with Fujitsu Corporation, where he has been instrumental in advancing semiconductor fabrication techniques. His work has contributed to the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Ohyama has collaborated with notable colleagues, including Masafumi Tetaka and Shinichiro Maki. Their combined expertise has further enhanced the innovations in semiconductor technology.

Conclusion

Nobuo Ohyama's contributions to semiconductor fabrication have established him as a key figure in the industry. His innovative methods continue to influence the development of advanced semiconductor devices.