Ageo, Japan

Nobuo Hayasaka


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Nobuo Hayasaka: Innovator in Printed Wiring Board Technology

Introduction

Nobuo Hayasaka is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of electronics, particularly in the development of materials used in printed wiring boards. His innovative work has led to advancements that benefit various industries.

Latest Patents

Hayasaka holds a patent for a resin-coated copper foil designed for multilayer printed wiring boards. This invention enhances the performance and reliability of electronic devices, making it a valuable asset in modern technology.

Career Highlights

Nobuo Hayasaka is associated with Mitsui Mining & Smelting Company, Ltd., where he has applied his expertise in materials science. His work at the company has been instrumental in pushing the boundaries of electronic component manufacturing.

Collaborations

Hayasaka has collaborated with notable colleagues, including Tetsurou Satoh and Hiroaki Tsuyoshi. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Nobuo Hayasaka's contributions to the field of printed wiring board technology exemplify the impact of dedicated inventors in advancing electronic materials. His work continues to influence the industry and inspire future innovations.

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