This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2001.
Company Filing History:
1 out of 834,411 Years Active: 2001
Title: Nobuo Ebina - Innovator in Microporous Copper Technology
Nobuo Ebina is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of microporous copper films. His innovative work has led to advancements in printed circuit board technology.
Latest Patents
Nobuo Ebina holds a patent for a microporous copper film and an electroless copper plating solution for obtaining the same. This patent describes a printed circuit board that comprises a metal copper film featuring 10 to 10 micropores per square centimeter. The metal copper film is prepared by dipping a plating object into an electroless copper plating solution that includes a copper ion, a complexing agent, a hypophosphorus acid compound, a metallic catalyst for initiating the reductive reaction, and a compound containing an acetylenic bond.
Career Highlights
Throughout his career, Nobuo Ebina has focused on enhancing the efficiency and effectiveness of copper plating processes. His work has been instrumental in improving the quality and performance of printed circuit boards, which are essential components in modern electronic devices.
Collaborations
Nobuo has collaborated with notable colleagues, including Hideo Honma and Tomoyuki Fujinami. These partnerships have fostered innovation and have contributed to the advancement of technology in their field.
Conclusion
Nobuo Ebina's contributions to the field of microporous copper technology have made a lasting impact on the electronics industry. His innovative patent and collaborative efforts highlight his dedication to advancing materials science.