Company Filing History:
Years Active: 2000
Title: Nobuaki Oie: Innovator in Electronic Devices and Semiconductor Packages
Introduction
Nobuaki Oie is a prominent inventor based in Ebina, Japan. He has made significant contributions to the field of electronic devices and semiconductor packaging. His innovative work has led to the development of a patented technology that addresses critical challenges in the industry.
Latest Patents
Nobuaki Oie holds a patent for an electronic device and semiconductor package. This invention features a structure where a semiconductor package is mounted on a mother board. To alleviate stress caused by cyclic thermal loads applied to solder bumps, which electrically and mechanically connect the semiconductor package to the mother board, a shape-holding plate, or stiffener, is adhered to a wiring film. This stiffener is composed of a metal with a thermal expansion coefficient ranging from 13×10⁻⁶ to 17×10⁻⁶, closely matching that of a glass-epoxy wiring substrate used as the mother board. Examples of suitable metals include 25Cr-20Ni stainless steel or a copper alloy containing 0.01 to 0.03% by weight of zirconium.
Career Highlights
Nobuaki Oie is associated with Kabushiki Kaisha Toshiba, a leading company in technology and electronics. His work at Toshiba has allowed him to focus on advancing semiconductor technology and improving electronic device performance. His innovative approach has garnered attention in the field, showcasing his expertise and commitment to innovation.
Collaborations
Nobuaki Oie has collaborated with notable colleagues, including Morihiko Ikemizu and Ken Iwasaki. These partnerships have contributed to the development of cutting-edge technologies and have enhanced the impact of their collective work in the industry.
Conclusion
Nobuaki Oie is a distinguished inventor whose contributions to electronic devices and semiconductor packages have made a significant impact in the field. His patented technology demonstrates his innovative spirit and dedication to solving complex engineering challenges.