Company Filing History:
Years Active: 2008
Title: Innovations by Nicholas Nunns in Integrated Circuit Packaging
Introduction
Nicholas Nunns is an accomplished inventor based in Amherst, MA (US). He has made significant contributions to the field of integrated circuit packaging, focusing on methods that enhance electromagnetic and thermal isolation between components. His innovative approach addresses critical challenges in the design and manufacturing of integrated circuit modules.
Latest Patents
Nicholas Nunns holds a patent for "Methods for integrated circuit module packaging and integrated circuit module packages." This patent presents a novel method for achieving electromagnetic and thermal isolation between closely positioned components on a common module substrate. The inventive methods utilize a grounded, metal-coated overmold for an integrated circuit module package. This design provides an alternate thermal path to heat sink high-power components that generate excess heat energy. Additionally, it offers general electromagnetic shielding and isolation between integrated circuits that are susceptible to electromagnetic interference. The patent details a dielectric layer that conformably covers semiconductor dies mounted on a substrate, with specific modifications to enhance heat dissipation and electromagnetic shielding.
Career Highlights
Nicholas Nunns is currently employed at Sige Semiconductor Corp., where he continues to innovate in the field of semiconductor technology. His work has been instrumental in developing solutions that improve the performance and reliability of integrated circuits. His expertise in packaging methods has positioned him as a valuable asset in the semiconductor industry.
Collaborations
Nicholas has collaborated with notable colleagues, including Jose Harrison and William Gerard Vaillancourt. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the field.
Conclusion
Nicholas Nunns is a prominent inventor whose work in integrated circuit packaging has made a significant impact on the industry. His patented methods for enhancing electromagnetic and thermal isolation are crucial for the advancement of semiconductor technology. His contributions continue to shape the future of integrated circuit design and manufacturing.