Neil Ricks

Title: Neil Ricks: Innovator in Optical Device Packaging

Introduction

Neil Ricks is a notable inventor based in Blacksburg, VA (US). He has made significant contributions to the field of optical device packaging, holding a total of 2 patents. His work focuses on innovative designs that enhance the functionality and efficiency of optical devices.

Latest Patents

Neil Ricks' latest patents include an optical device package and wafer level packaging for optoelectronic devices. The optical device package features a substrate with an upper surface, a distal end, a proximal end, and longitudinally extending notches that are co-linearly aligned. A structure, which can be a lid or a frame, is mounted to the substrate and includes at least one recessed portion. An optical fiber is positioned within the notches and the recessed portion, while conductive legs extend upwardly from bonding pads on the substrate's upper surface. This design facilitates the flip mounting of the optical device package onto a circuit board or similar platform.

Career Highlights

Throughout his career, Neil Ricks has worked with prominent companies such as Shipley Company LLC and Samsung Electronics Co., Ltd. His experience in these organizations has contributed to his expertise in optical device packaging and related technologies.

Collaborations

Neil has collaborated with notable individuals in his field, including David W. Sherrer and Dan A. Steinberg. These collaborations have likely enriched his work and led to further advancements in optical device technology.

Conclusion

Neil Ricks is a distinguished inventor whose work in optical device packaging has made a significant impact in the industry. His innovative patents and collaborations reflect his commitment to advancing technology in this field.