Naonori Michishita

Title: Naonori Michishita: Innovator in Metal Covered Polyimide Composites

Introduction

Naonori Michishita is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of materials science, particularly in the development of metal covered polyimide composites. With a total of 2 patents to his name, Michishita's work has implications for various applications, including electronic circuit boards.

Latest Patents

Michishita's latest patents focus on processes and apparatuses for producing metal covered polyimide composites. One of his notable inventions involves a composite that includes a tie-coat layer and a metal seed layer formed on a polyimide film. This is achieved through electroless plating or a drying method, followed by the formation of a copper or copper alloy layer through electroplating. His innovations effectively prevent peeling in non-adhesive flexible laminates, particularly at the interface of copper layers and tin plating. Additionally, he has developed methods for producing these composites and electronic circuit boards.

Career Highlights

Naonori Michishita is currently associated with JX Nippon Mining & Metals Corporation, where he continues to advance his research and development efforts. His work has garnered attention for its practical applications in the electronics industry, showcasing his expertise in material engineering.

Collaborations

Throughout his career, Michishita has collaborated with notable colleagues, including Michiya Kohiki and Nobuhito Makino. These partnerships have contributed to the successful development of his innovative technologies.

Conclusion

Naonori Michishita stands out as a key figure in the field of metal covered polyimide composites. His patents and ongoing research reflect his commitment to advancing technology in materials science.