Osaka, Japan

Naoki Suyama


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 1990

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Naoki Suyama: Innovator in Copper Indium Diselenide Production

Introduction

Naoki Suyama is a prominent inventor based in Osaka, Japan. He is known for his significant contributions to the field of materials science, particularly in the production of copper indium diselenide (CuInSe₂) films. His innovative methods have paved the way for advancements in solar energy technology.

Latest Patents

Suyama holds a patent for a method of production of copper indium diselenide. This method involves adding a liquid cooling medium to a mixture of copper, indium, and selenium powders. The resulting composition is ground using a ball mill to create a slurry containing CuInSe₂ of low crystallinity. The process continues with drying and adding a binding agent to form a paste, which is then coated onto a substrate and sintered under a nitrogen atmosphere. This method allows for the production of CuInSe₂ of excellent quality on a mass production scale at a low cost.

Career Highlights

Naoki Suyama is associated with Matsushita Electric Industrial Co., Ltd., where he has made significant contributions to research and development. His work has been instrumental in enhancing the efficiency and cost-effectiveness of solar cell production.

Collaborations

Suyama has collaborated with notable colleagues, including Noriyuki Ueno and Kuniyoshi Omura. Their combined expertise has further advanced the research in the field of materials science.

Conclusion

Naoki Suyama's innovative methods in the production of copper indium diselenide have made a lasting impact on the solar energy industry. His contributions continue to influence advancements in renewable energy technologies.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…