Shiga, Japan

Naoki Ohno

USPTO Granted Patents = 5 


 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Moriyama, JP (2012 - 2017)
  • Shiga, JP (2019 - 2024)

Company Filing History:


Years Active: 2012-2024

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5 patents (USPTO):Explore Patents

Title: Naoki Ohno: Innovator in Heat-Shrinkable Technology

Introduction

Naoki Ohno is a prominent inventor based in Shiga, Japan. He has made significant contributions to the field of materials science, particularly in the development of heat-shrinkable multilayer films and labels. With a total of five patents to his name, Ohno's work has advanced the capabilities of packaging materials.

Latest Patents

Ohno's latest patents focus on heat-shrinkable multilayer films that enhance seal strength and transparency. One of his inventions provides a heat-shrinkable multilayer film that allows for the production of labels with high seal strength, regardless of interlaminar strength. This innovation includes front and back layers made of polyester resin, an interlayer of polystyrene resin, and adhesive layers that ensure durability and clarity. Another patent addresses the prevention of wrinkles or loosening after attachment, making it ideal for use as a heat-shrinkable label on containers. This film demonstrates a controlled dimensional change, ensuring reliability during application.

Career Highlights

Naoki Ohno is associated with Gunze Limited, a company known for its innovative materials and technologies. His work has not only contributed to the company's portfolio but has also set new standards in the industry for heat-shrinkable films.

Collaborations

Ohno collaborates with notable colleagues such as Tadayoshi Tanaka and Masaharu Maruo. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Naoki Ohno's contributions to the field of heat-shrinkable technology exemplify the impact of innovative thinking in materials science. His patents reflect a commitment to enhancing product performance and reliability in packaging solutions.

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