Company Filing History:
Years Active: 2018-2024
Title: Naoki Komai: Innovator in Packaging Technology
Introduction
Naoki Komai is a prominent inventor based in Ritto, Japan. He has made significant contributions to the field of packaging technology, holding a total of 3 patents. His innovative designs focus on enhancing the efficiency and quality of packaging processes.
Latest Patents
One of Naoki Komai's latest patents is a packaging apparatus designed to inhibit a reduction in printing quality with respect to a film. This apparatus includes a film conveyance device that conveys a film, a moving mechanism that conveys a container with an opening, and a sealing device that seals the opening of the container with the film. Additionally, a printer is positioned upstream of the sealing device to print information on the film while it is being conveyed. The controller manages the operation of the film conveyance device, which features an accumulation mechanism that temporarily stores the printed film before sealing.
Another notable invention is a label printer that issues a reserved number of printed labels containing information about a designated commodity. This label printer includes a designation means for selecting a commodity, an input means for specifying the number of labels to be printed, and a registration means that registers the reservation while the labels are being issued.
Career Highlights
Naoki Komai is currently employed at Ishida Co. Limited, where he continues to develop innovative packaging solutions. His work has significantly impacted the efficiency of packaging processes in various industries.
Collaborations
Naoki has collaborated with several talented individuals, including Osamu Hiraiwa and Suguru Doiguchi. Their combined expertise has contributed to the advancement of packaging technology.
Conclusion
Naoki Komai's contributions to packaging technology through his innovative patents demonstrate his commitment to improving industry standards. His work continues to influence the field and inspire future innovations.