Tokyo, Japan

Naoki Honma


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal1 out of 832,761 
Other
 patents

Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: The Innovations of Naoki Honma: A Pioneer in Silicon Technology

Introduction: Naoki Honma, an esteemed inventor based in Tokyo, Japan, has made significant contributions to the field of silicon-containing solutions. With one notable patent to his name, his work reflects a keen understanding of chemical compositions that enhance various industrial applications.

Latest Patents: Honma's patent, titled "Coating process and silicon-containing liquid composition", introduces a unique formula comprising 100 parts by weight of an organosilicate, 0.1 to 10 parts by weight of a catalyst, and a ratio of water to solvent ranging from 30:70 to 80:20. This innovative composition is designed to optimize silicon technology processes, providing a versatile tool for manufacturers in diverse sectors.

Career Highlights: Throughout his career, Naoki Honma has demonstrated a commitment to advancing silicon technology. His patent showcases his ability to innovate within the realm of chemical engineering, contributing to the efficiency and efficacy of silicon-based coatings.

Collaborations: Collaborating alongside notable peers such as Katsuo Kobayashi and Wakako Fukamachi, Honma has been part of a dynamic team that fosters creativity and innovation. These partnerships have played a crucial role in the development of his groundbreaking work, illustrating the importance of collaboration in the field of inventions.

Conclusion: Naoki Honma stands out as an influential inventor in the realm of silicon-containing technologies. His innovative approach to creating efficient compositions through his patent demonstrates the potential for advancements in industrial applications. As technology evolves, contributions from inventors like Honma will continue to shape the future of manufacturing processes.

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