Company Filing History:
Years Active: 1995
Title: Morio Misono: Innovator in IC Package Inspection Technology
Introduction
Morio Misono is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of integrated circuit (IC) packaging technology. His innovative approach has led to the development of a unique apparatus designed for inspecting IC packages.
Latest Patents
Misono holds a patent for an IC package inspection apparatus. This apparatus is designed to inspect the outward appearance of each IC package stored in an embossed tape. It features a drive wheel that rotates in a vertical plane, allowing for the movement of the embossed tape. A pair of cameras are strategically mounted to capture images of each IC package from two different angles. This design effectively prevents any diffused reflection of light by the cover tape and ensures that each IC package remains properly aligned during inspection.
Career Highlights
Morio Misono is associated with Sony Corporation, a leading company in the technology sector. His work at Sony has allowed him to focus on advancements in IC packaging, contributing to the company's reputation for innovation and quality.
Collaborations
Misono has collaborated with talented coworkers such as Tomohide Tokumaru and Tetsuo Abe. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Morio Misono's contributions to IC package inspection technology exemplify the spirit of innovation. His patent reflects a commitment to improving the quality and efficiency of electronic components. Through his work at Sony Corporation, Misono continues to influence the field of technology positively.