This inventor holds 2 USPTO granted patents. Top assignee: Nitto-Denko Corporation. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Mitsuo Iimura: Innovator in Semiconductor Technology
Introduction
Mitsuo Iimura is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to engineering solutions.
Latest Patents
Iimura's latest patents include a method of resin-encapsulating semiconductor chips and a release member for producing multi-layer printed wiring boards. The resin-encapsulation method utilizes a polytetrafluoroethylene film as a mold-releasing film, ensuring high yield and preventing resin coverage on terminals. The release member features a thermoplastic layer that flows toward the hole upon melting, demonstrating advanced engineering in laminate production.
Career Highlights
Mitsuo Iimura has built a successful career at Nitto Denko Corporation, where he has been instrumental in developing innovative materials and methods for the semiconductor industry. His work has significantly impacted the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
Iimura has collaborated with notable colleagues such as Toshimitsu Tachibana and Kenji Sato, contributing to a dynamic team focused on advancing technology in their field.
Conclusion
Mitsuo Iimura's contributions to semiconductor technology through his patents and work at Nitto Denko Corporation highlight his role as a key innovator in the industry. His advancements continue to influence the future of semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile