Osaka, Japan

Mitsuo Iimura


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2001

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Mitsuo Iimura: Innovator in Semiconductor Technology

Introduction

Mitsuo Iimura is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to engineering solutions.

Latest Patents

Iimura's latest patents include a method of resin-encapsulating semiconductor chips and a release member for producing multi-layer printed wiring boards. The resin-encapsulation method utilizes a polytetrafluoroethylene film as a mold-releasing film, ensuring high yield and preventing resin coverage on terminals. The release member features a thermoplastic layer that flows toward the hole upon melting, demonstrating advanced engineering in laminate production.

Career Highlights

Mitsuo Iimura has built a successful career at Nitto Denko Corporation, where he has been instrumental in developing innovative materials and methods for the semiconductor industry. His work has significantly impacted the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Iimura has collaborated with notable colleagues such as Toshimitsu Tachibana and Kenji Sato, contributing to a dynamic team focused on advancing technology in their field.

Conclusion

Mitsuo Iimura's contributions to semiconductor technology through his patents and work at Nitto Denko Corporation highlight his role as a key innovator in the industry. His advancements continue to influence the future of semiconductor manufacturing.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…