Location History:
- Hirakata, JP (1997 - 1998)
- Osaka, JP (1999 - 2000)
Company Filing History:
Years Active: 1997-2000
Title: Mitsuo Asabe: Innovator in Substrate Technology
Introduction
Mitsuo Asabe is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of substrate technology, holding a total of 4 patents. His work focuses on enhancing the electric properties and reliability of substrates used in various electronic applications.
Latest Patents
One of Asabe's latest patents is titled "Substrate on which bumps are formed and method of forming the same." This innovation features a bi-layer bump structure that includes a base layer made of sprayed aluminum thick film, approximately 20 micrometers thick, which covers the periphery of the passivation film on each pad electrode. The surface layer consists of a sprayed copper thick film, about 30 micrometers thick, applied on top of the base layer. This design aims to provide a substrate with excellent electric properties and connecting reliability, allowing for the integration of an interlayer insulating layer, an active layer, and multi-layer wiring beneath the pad electrode.
Career Highlights
Mitsuo Asabe is currently employed at Matsushita Electric Industrial Co., Ltd., where he continues to develop innovative solutions in substrate technology. His expertise and dedication have positioned him as a key figure in his field.
Collaborations
Asabe has collaborated with notable coworkers, including Kazufumi Yamaguchi and Tsutomu Mitani, contributing to advancements in their shared projects.
Conclusion
Mitsuo Asabe's work in substrate technology exemplifies innovation and dedication to improving electronic components. His patents reflect a commitment to enhancing the performance and reliability of substrates in the industry.