Company Filing History:
Years Active: 2001
Title: Miquel A Jimarez: Innovator in Flip-Chip Electronic Packages
Introduction
Miquel A Jimarez is a notable inventor based in Newark Valley, NY (US). He has made significant contributions to the field of electronic packaging, particularly through his innovative patent related to flip-chip technology. His work focuses on enhancing the reliability and performance of electronic devices.
Latest Patents
Miquel A Jimarez holds a patent for a "Compliant surface layer for flip-chip electronic packages and method for forming same." This invention addresses the challenges posed by differences in coefficients of thermal expansion between chips and substrates. The compliant surface layer is strategically positioned between an underfill layer and a substrate, such as a chip carrier or printed circuit board. This layer reduces stress and strain, thereby improving the longevity and functionality of electronic packages. The compliant layer is designed to have a storage modulus of less than half that of the substrate, ideally ranging between about 50,000 psi and about 20,000 psi. It may consist of rubbery materials, including silicone and virco-plastic polymers like polytetrafluoroethylene, as well as interpenetrating polymer networks (IPNs), with photosensitive IPNs being preferred for solder marks.
Career Highlights
Miquel A Jimarez is associated with International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in electronic packaging. His expertise in the field has positioned him as a valuable asset to the company and the industry at large.
Collaborations
Throughout his career, Miquel has collaborated with talented individuals such as Eric A Johnson and Li Li. These collaborations have fostered innovation and have led to advancements in electronic packaging technologies.
Conclusion
Miquel A Jimarez is a distinguished inventor whose work in flip-chip electronic packages has made a significant impact on the industry. His innovative approach to reducing stress and strain in electronic devices showcases his commitment to advancing technology.