Location History:
- Saitama, JP (1985 - 1986)
- Sayama, JP (2003 - 2004)
Company Filing History:
Years Active: 1985-2004
Title: Minoru Hiroyasu: Innovator in Cutting Technology
Introduction
Minoru Hiroyasu is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of cutting technology, holding a total of 5 patents. His innovative approaches have led to advancements in manufacturing processes, particularly in the creation of cutting tips.
Latest Patents
One of Hiroyasu's latest patents is a cutting tip and method thereof. This invention features a cutting tip with a three-layer laminated structure. The tip is constructed from a disc-shaped three-layer laminate, where a second layer made of a hard sintered compact of CBN or diamond is sandwiched between a first layer and a third layer composed of a tool material such as cemented carbide. The process involves cutting prismatic blanks of rectangular cross-section from the three-layer laminate in strips. Semi-completed tips of a desired shape are then obtained by cutting the prismatic blanks. Desired cutting edges are formed on these semi-completed tips to produce finished tips. This method allows for the production of semi-completed tips in large quantities, resulting in high yield and reduced manufacturing costs.
Career Highlights
Minoru Hiroyasu is currently employed at Honda Giken Kogyo Kabushiki Kaisha, a company renowned for its innovations in automotive technology. His work has been instrumental in enhancing the efficiency and effectiveness of cutting tools used in various applications.
Collaborations
Hiroyasu collaborates with talented coworkers, including Satomi Isibasi and Masatomi Ito. Their combined expertise contributes to the development of cutting-edge technologies in their field.
Conclusion
Minoru Hiroyasu's contributions to cutting technology exemplify the spirit of innovation. His patents reflect a commitment to improving manufacturing processes and reducing costs. His work continues to influence the industry positively.