Mingyu Wang

Title: The Innovative Contributions of Mingyu Wang

Introduction

Mingyu Wang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of microelectronics, particularly in chip packaging technology. His work has led to advancements that enhance the performance and efficiency of electronic devices.

Latest Patents

Mingyu Wang holds a patent for a chip package structure and method for manufacturing the same. This patent describes a chip package structure that includes a substrate, a wiring layer, a chip, and a second conductive bump. The design features a substrate with a first region and a second region surrounding it. The wiring layer, which includes metal wire, is positioned on the side of the substrate, with at least part of the metal wire in contact with the substrate. The chip is located on the side of the wiring layer that faces away from the substrate, corresponding to the first region. Additionally, a first conductive bump is provided on the side of the chip facing away from the substrate, electrically connecting to the metal wire.

Career Highlights

Mingyu Wang is currently employed at Shanghai Tianma Micro-electronics Co., Ltd. His role at the company allows him to apply his innovative ideas and contribute to the development of cutting-edge microelectronic solutions. His expertise in chip packaging has positioned him as a valuable asset in the industry.

Collaborations

Mingyu has collaborated with talented coworkers such as Kerui Xi and Xuhui Peng. Their combined efforts have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Mingyu Wang's contributions to the field of microelectronics, particularly through his patented chip package structure, demonstrate his commitment to innovation. His work continues to influence the industry and pave the way for future advancements in technology.