Hong Kong, China

Ming-Yi Leung

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Ming-Yi Leung in Organic Light-Emitting Devices

Introduction

Ming-Yi Leung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of organic light-emitting devices (OLEDs). His innovative work focuses on luminescent gold(III) compounds that exhibit thermally stimulated delayed phosphorescence (TSDP) properties.

Latest Patents

Ming-Yi Leung holds 1 patent for his invention titled "Luminescent gold(III) compounds with thermally stimulated delayed phosphorescence (TSDP) property for organic light-emitting devices and their preparation." This patent discloses a novel class of gold(III) compounds that include a triazine-containing cyclometalating tridentate ligand and an auxiliary ligand, both coordinated to a gold(III) metal center. The compounds are designed to be used as light-emitting materials in the fabrication of OLEDs. The invention introduces a novel concept of TSDP, which allows for the harvesting of light emission from higher energy triplet excited states through efficient spin-allowed reverse internal conversion.

Career Highlights

Ming-Yi Leung is affiliated with The University of Hong Kong, where he continues to advance research in the field of organic electronics. His work has garnered attention for its potential applications in next-generation display technologies.

Collaborations

Ming-Yi collaborates with esteemed colleagues, including Vivian Wing-Wah Yam and Man-Chung Tang. Their combined expertise contributes to the innovative research environment at The University of Hong Kong.

Conclusion

Ming-Yi Leung's contributions to the field of organic light-emitting devices through his innovative patents highlight the importance of research in advancing technology. His work exemplifies the potential of gold(III) compounds in creating efficient light-emitting materials for future applications.

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