Company Filing History:
Years Active: 2019
Title: The Innovations of Ming-Wen Liao
Introduction
Ming-Wen Liao is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of advanced semiconductor device packages.
Latest Patents
Ming-Wen Liao holds a patent for a semiconductor device package. This package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body. The EMI shield features a side portion that defines an opening. This invention showcases his expertise in enhancing the functionality and efficiency of semiconductor devices.
Career Highlights
Ming-Wen Liao is currently employed at Universal Scientific Industrial (Shanghai) Co., Ltd. His role at the company allows him to work on cutting-edge technologies and contribute to the advancement of semiconductor solutions. His dedication to innovation has positioned him as a key figure in his field.
Collaborations
Ming-Wen Liao collaborates with talented individuals such as Ji-Min Lin and Chun-Ying Huang. These partnerships foster a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Ming-Wen Liao's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the industry. His work continues to influence the development of advanced electronic devices.