This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: National Central University. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: The Innovations of Ming-Chung Kuo
Introduction
Ming-Chung Kuo is a notable inventor based in Qieding Shiang, Taiwan. He has made significant contributions to the field of bonding technologies, particularly through his innovative patent related to tin-silver bonding.
Latest Patents
Ming-Chung Kuo holds a patent for a method of tin-silver bonding, which is detailed as follows: A Sn–Ag bonding and a method thereof are revealed. By means of a bonding layer formed by tin and silver between wafers, the stress released by diffusion and bonding between tin (Sn) and silver (Ag) is larger than the stress released by diffusion and bonding of conventional gold-silver bonding. Moreover, a Sn–Ag bonding method of the present invention forms Sn–Ag bonding at low temperature and releases more stress, effectively reducing thermal stress generated during wafer bonding. After wafer bonding, high-temperature processes can be performed.
Career Highlights
Ming-Chung Kuo is affiliated with National Central University, where he continues to advance his research and development in bonding technologies. His work has garnered attention for its potential applications in various industries.
Collaborations
Ming-Chung Kuo collaborates with Cheng-Yi Liu, who is a valuable coworker in his research endeavors.
Conclusion
Ming-Chung Kuo's innovative work in tin-silver bonding represents a significant advancement in bonding technologies, showcasing his expertise and contributions to the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile